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| Model Number: | C4 Mainboard |
| MOQ: | Negotiable |
| Price: | Negotiable |
| Delivery Time: | 5-8 work days |
| Payment Terms: | T/T |
C4 Smart Computing Motherboard
Powered by the Rockchip RK3399 hexa-core processor (dual-core Cortex-A72 @ 1.8GHz + quad-core Cortex-A53 @ 1.4GHz), the C4 Smart Computing Motherboard delivers premium processing power in a compact 100mm × 77mm form factor. This big.LITTLE architecture intelligently balances high-performance and energy-efficient tasks, making it ideal for AI-assisted applications, edge computing, and multimedia-intensive industrial systems. The integrated Mali-T860 GPU supports OpenGL ES 1.1/2.0/3.0/3.1 and hardware-accelerated 4K video decoding, delivering stunning visuals for demanding display applications. Featuring a Type-C USB port, USB 3.0, and Gigabit Ethernet, this board offers significantly faster data transfer than entry-level alternatives. With 2× TTL/RS-232 serial ports, 9× GPIO, VGA and HDMI 2.0 outputs (up to 4K), plus MiniPCI-E for 4G expansion, the C4 packs exceptional connectivity into a tiny footprint. The onboard RTC with CR1220 battery backup supports scheduled power-on/off, while the 9V–15V wide voltage input ensures stable operation across various power environments. Ships with Android 7.1 (upgradeable to 8.1), with open API SDK available for custom development. Operating temperature range 0°C to 70°C.
Big.LITTLE Hexa-Core Performance: The RK3399's dual Cortex-A72 cores handle heavy computing tasks while the quad Cortex-A53 cores manage background operations — delivering desktop-class performance with excellent power efficiency. Perfect for AI inference, multitasking, and compute-intensive edge applications.
Next-Gen Connectivity: Stands out with USB Type-C, USB 3.0, and Gigabit Ethernet — offering significantly faster data transfer speeds compared to standard USB 2.0 boards. Ideal for high-bandwidth applications like high-res cameras and large data transfers.
Premium 4K Visuals with Advanced GPU: Mali-T860 GPU with OpenGL ES 3.1 support delivers true 4K hardware decoding and superior 3D graphics performance — making it ideal for immersive HMI, 4K video walls, and visually demanding interactive applications.
Flexible Android Version Options: Ships with Android 7.1 with upgrade path to 8.1 — giving developers the flexibility to choose the right OS version for their specific application requirements.
Compact Board, Desktop-Class Specs: At just 100mm × 77mm, this board delivers the processing power of a desktop PC with 4K output, USB 3.0, Type-C, and Gigabit Ethernet — making it the most powerful board in the C-series lineup.
Desktop Performance at Mini Size: The RK3399 is one of the most powerful processors in its class. With dual 1.8GHz Cortex-A72 cores, the C4 handles AI inference, 4K video, and multitasking with ease — performance comparable to entry-level desktop PCs in a 100mm × 77mm package.
Faster Data, Better Experience: USB Type-C and USB 3.0 deliver data transfer speeds up to 10x faster than USB 2.0. Combined with Gigabit Ethernet, the C4 is built for high-speed data applications — from high-resolution cameras to large file transfers.
AI-Ready Processing Power: The big.LITTLE architecture provides the compute headroom needed for AI inference at the edge. Run TensorFlow Lite models, computer vision, and machine learning applications directly on the board — no cloud latency, no external NPU required (though expansion is available).
Built for the Future: With support for Android 8.1, USB 3.0, and Gigabit Ethernet, the C4 is designed to stay relevant longer. Future-proof your product with a board that can handle tomorrow's software demands.
Industrial Reliability with Premium Performance: Rockchip RK3399 is proven in demanding environments, with 0°C–70°C operating temperature and 95% humidity tolerance. Get industrial-grade reliability without compromising on performance or connectivity.
| Item | Details |
|---|---|
| Packaging | Anti-static bag + foam padding + industrial carton |
| MOQ | 1 piece (sample order), 100+ for volume pricing |
| Lead Time | 3–5 working days for samples; 15–20 working days for bulk orders |
| Shipping | DHL, FedEx, UPS, or by sea (customer's choice) |
|
|
| Model Number: | C4 Mainboard |
| MOQ: | Negotiable |
| Price: | Negotiable |
| Payment Terms: | T/T |
C4 Smart Computing Motherboard
Powered by the Rockchip RK3399 hexa-core processor (dual-core Cortex-A72 @ 1.8GHz + quad-core Cortex-A53 @ 1.4GHz), the C4 Smart Computing Motherboard delivers premium processing power in a compact 100mm × 77mm form factor. This big.LITTLE architecture intelligently balances high-performance and energy-efficient tasks, making it ideal for AI-assisted applications, edge computing, and multimedia-intensive industrial systems. The integrated Mali-T860 GPU supports OpenGL ES 1.1/2.0/3.0/3.1 and hardware-accelerated 4K video decoding, delivering stunning visuals for demanding display applications. Featuring a Type-C USB port, USB 3.0, and Gigabit Ethernet, this board offers significantly faster data transfer than entry-level alternatives. With 2× TTL/RS-232 serial ports, 9× GPIO, VGA and HDMI 2.0 outputs (up to 4K), plus MiniPCI-E for 4G expansion, the C4 packs exceptional connectivity into a tiny footprint. The onboard RTC with CR1220 battery backup supports scheduled power-on/off, while the 9V–15V wide voltage input ensures stable operation across various power environments. Ships with Android 7.1 (upgradeable to 8.1), with open API SDK available for custom development. Operating temperature range 0°C to 70°C.
Big.LITTLE Hexa-Core Performance: The RK3399's dual Cortex-A72 cores handle heavy computing tasks while the quad Cortex-A53 cores manage background operations — delivering desktop-class performance with excellent power efficiency. Perfect for AI inference, multitasking, and compute-intensive edge applications.
Next-Gen Connectivity: Stands out with USB Type-C, USB 3.0, and Gigabit Ethernet — offering significantly faster data transfer speeds compared to standard USB 2.0 boards. Ideal for high-bandwidth applications like high-res cameras and large data transfers.
Premium 4K Visuals with Advanced GPU: Mali-T860 GPU with OpenGL ES 3.1 support delivers true 4K hardware decoding and superior 3D graphics performance — making it ideal for immersive HMI, 4K video walls, and visually demanding interactive applications.
Flexible Android Version Options: Ships with Android 7.1 with upgrade path to 8.1 — giving developers the flexibility to choose the right OS version for their specific application requirements.
Compact Board, Desktop-Class Specs: At just 100mm × 77mm, this board delivers the processing power of a desktop PC with 4K output, USB 3.0, Type-C, and Gigabit Ethernet — making it the most powerful board in the C-series lineup.
Desktop Performance at Mini Size: The RK3399 is one of the most powerful processors in its class. With dual 1.8GHz Cortex-A72 cores, the C4 handles AI inference, 4K video, and multitasking with ease — performance comparable to entry-level desktop PCs in a 100mm × 77mm package.
Faster Data, Better Experience: USB Type-C and USB 3.0 deliver data transfer speeds up to 10x faster than USB 2.0. Combined with Gigabit Ethernet, the C4 is built for high-speed data applications — from high-resolution cameras to large file transfers.
AI-Ready Processing Power: The big.LITTLE architecture provides the compute headroom needed for AI inference at the edge. Run TensorFlow Lite models, computer vision, and machine learning applications directly on the board — no cloud latency, no external NPU required (though expansion is available).
Built for the Future: With support for Android 8.1, USB 3.0, and Gigabit Ethernet, the C4 is designed to stay relevant longer. Future-proof your product with a board that can handle tomorrow's software demands.
Industrial Reliability with Premium Performance: Rockchip RK3399 is proven in demanding environments, with 0°C–70°C operating temperature and 95% humidity tolerance. Get industrial-grade reliability without compromising on performance or connectivity.
| Item | Details |
|---|---|
| Packaging | Anti-static bag + foam padding + industrial carton |
| MOQ | 1 piece (sample order), 100+ for volume pricing |
| Lead Time | 3–5 working days for samples; 15–20 working days for bulk orders |
| Shipping | DHL, FedEx, UPS, or by sea (customer's choice) |
